As I Am Bond Conditioner

A strengthening and moisturizing conditioner that deeply nourishes while repairing damaged hair. Enriched with Bond Complex Technology and Sub Micron Technology, it restores elasticity, smooths the cuticle, and delivers long-lasting hydration for strong, vibrant curls.

Bond Complex Technology - This innovative technology reconnects broken disulfide bonds, restoring elasticity and reinforcing the hair structure for improved strength, resilience, and shine.

Sub-Micron Technology - Our advanced sub-micron technology breaks ingredients down into ultra-fine particles, allowing deeper penetration into the hair and scalp. This ensures superior hydration, improved manageability, and enhanced protection against future damage.

8oz

• After cleansing, apply generously to the lengths of the hair.
• Rake through with fingers or a wide-tooth comb to ensure even distribution and help detangling.
• Leave on for at least 3 minutes for maximum hydration.
• Rinse thoroughly and follow with the As I Am Bond Leave- In Conditioner for optimal results.

Aqua/Water/Eau, Betaine, Cetearyl Alcohol, Cetyl Alcohol, Brassicamido-propyl Dimethylamine, Hydrogenated Polydecene, Moringa Oleifera Leaf Extract, Phyllanthus Emblica Fruit Extract, Ceramide NP, Ceramide EOP, Ceramide AP, Copper Tripeptide-1, Phytosphingosine, Serenoa Serrulata Fruit Extract, Phytosterols, Hydroxypropyl Bislauramide MEA, Hydroxypropyl Bisstearamide MEA, Hydroxypropylgluconamide, Hydroxypropylammonium Gluconate, Biotin, Potassium Olivate, Polyglyceryl-10 Stearate, Stearic Acid, Fragrance/Parfum, Polyquaternium-37 Propylene Glycol Dicaprylate/Dicaprate, PPG-1 Trideceth-6, Polyquaternium-7, Lactic Acid, Caprylyl Glycol, Ethylhexylglycerin, Sodium Benzoate, Potassium Sorbate, Polyacrylamide, Maltodextrin, Limonene